AP-130-01 Measuring the 2.5D Profile of Silicon Wafers for Increased Wafer Fabrication Efficiency and Integrated Circuit Yields

Accurately measuring semiconductor chips early in the manufacturing process allows product engineers, quality managers, plant managers, and lab managers to identify product issues as soon as possible. These early catches allow for alterations to reduce the waste costs and product defects.

Our latest application note reviews how interferometry can increase quality throughput in non-contact measurement of silicon wafers, which is critical in determining accurate thickness.

In the app note, we explore how the Lumetrics OptiGauge II measures the simultaneous wafer thickness, adhesive thickness, and parallelism between surfaces to sub-micron precision.

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